The Reaper CL4 4GB kit is designed to offer consumers a high end, high density kit that is optimized for gamers who require both faster and more memory to power through the latest graphic-intensive applications and games. The Reaper series makes use of the HPC heatspreader, an innovative patent-pending cooling solution developed by OCZ to effectively minimize heat produced by high-speed memory. As heat rises into the thermo-conductive copper heat pipe conduit, it is dissipated through the strategically-placed compact aluminum fin array. By guiding performance-robbing heat away from key memory components, the unique Reaper HPC design helps facilitate improved overclocking performance, while improving longevity and stability of the modules.
OCZ Technology Answers Enthusiast Demands for a Complete High-End Memory Solution
Sunnyvale, CA – October 10, 2007 – OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today announced the 4GB PC2-6400 CL4 series, the latest edition to the highly-awarded OCZ Reaper HPC (Heat Pipe Conduit) product family. With a proven performance design coupled with the blazing latencies and memory capacity enthusiasts crave, the 4GB PC2-6400 Reaper CL4 series provides rock-solid stability and performance on the latest AMD and Intel platforms.
The Reaper CL4 4GB kit is designed to offer consumers a high end, high density kit that is optimized for gamers who require both faster and more memory to power through the latest graphic-intensive applications and games. The Reaper series makes use of the HPC heatspreader, an innovative patent-pending cooling solution developed by OCZ to effectively minimize heat produced by high-speed memory. As heat rises into the thermo-conductive copper heat pipe conduit, it is dissipated through the strategically-placed compact aluminum fin array. By guiding performance-robbing heat away from key memory components, the unique Reaper HPC design helps facilitate improved overclocking performance, while improving longevity and stability of the modules.
The Reaper CL4 4GB kit is designed to offer consumers a high end, high density kit that is optimized for gamers who require both faster and more memory to power through the latest graphic-intensive applications and games. The Reaper series makes use of the HPC heatspreader, an innovative patent-pending cooling solution developed by OCZ to effectively minimize heat produced by high-speed memory. As heat rises into the thermo-conductive copper heat pipe conduit, it is dissipated through the strategically-placed compact aluminum fin array. By guiding performance-robbing heat away from key memory components, the unique Reaper HPC design helps facilitate improved overclocking performance, while improving longevity and stability of the modules.
